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UDM LLC.  Surfactant Consumables
UDM Semiconductor UDM Solar

UDM Surfactant LLC

Package Singulation Application – QFN (Semiconductor)

  • AKLC400_A Lubricant Series is a biodegradable water based lubricant.
  • DI /RO water: cutting/slicing fluid is 300:1 to 500 :1
  • Excellent wetting and rinsing properties
  • Reduces the surface tension of cutting/slicing water solution to about 22.0 to 25.0 mN/m
  • Increases heat transfer (heat dissipation) thereby reducing thermal stress
  • Prevents silicon swarf agglomeration, allowing for easier cutting and burr reduction

Environmental Benefits and Cost
  • Biodegradable, non-hazardous and easily disposable
  • Biochemical Oxygen Demand (BOD) < 2.0 mg/L (BOD less than 2.0 mg/L)
  • Chemical Oxygen Demand (COD) < 10.0 mg/L (COD less than 10.0 mg/L)


Download UDM Semiconductor Brochure


De-Glue and Detergent Concentrate for Photovoltaic Wafers

AKLC300_A De-Glue is a biodegradable water-based, non-caustic and non-acidic material.

  • PV wafer De-glue or De-bonding after wafering process.
  • DI /RO water: Detergent dilution ratio – 10:1 to 30 :1.
  • Application temperature 25°C to 70°C.
  • Excellent wetting, De-bonding and rinsing properties.
  • Water surface tension reducer.


AKLC300_B Detergent is a biodegradable water based, non-caustic and non-acidic material
  • PV wafer cleaning after wafering.
  • DI /RO water: Detergent dilution ratio – 10:1 to 50 :1.
  • Application temperature 45°C to 70°C.
  • Excellent wetting, de-bonding and rinsing properties.
  • Water surface tension reducer.
  • Completely cleans out SiC (silicon carbide) dust and other contaminants on wafer surfaces.
  • Eliminates Cu (Copper) and Fe (Iron) on PV wafer surfaces after wafering and De-gluing process.
  • Biochemical Oxygen Demand (BOD) < 2.0 mg/L (BOD less than 2.0 mg/L).
  • Chemical Oxygen Demand (COD) < 10.0 mg/L (COD less than 10.0 mg/L).


Download UDM SOLAR Brochure